Package Reliability Engineer

Celestial AI is seeking an experienced Package Reliability Engineer with expertise in 2.5D/3D advanced packaging. The ideal candidate will have a strong background in physics of failure, materials science, and experience working closely with OSATs to drive package reliability improvements.

Requirements

• Master's or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Applied Physics, or a related field.
• 5-10 years of hands-on experience in 2.5D/3D advanced packaging reliability.
• Deep understanding of physics of failure (PoF) methodologies for package reliability.
• Strong knowledge of materials science, particularly in interconnects, substrates, and interfaces.
• Proficiency in stress modeling tools (ANSYS, Abaqus, COMSOL, etc.) for thermo-mechanical analysis.
• Experience with failure analysis techniques such as C-SAM, X-ray CT, SEM, TEM, FIB, and EBSD.
• Proven track record of working with and driving OSAT partners for package reliability, yield, and continuous quality improvements.
• Experience managing OSAT qualifications, failure analysis, and corrective actions.
• Familiarity with supplier engagement, reliability testing at OSATs, and package process flows.
• Industry Knowledge: Familiarity with JEDEC, IPC, IEEE, and MIL-STD reliability standards.

Benefits

• health insurance
• vision insurance
• dental insurance
• life insurance