Technology & Innovation Organization Hardware Engineering Internship
HPCorvallis, Oregon, United States
Posted November 13, 2025
58000 - 70000 USD year
Internship
About the Company
HP is an equal opportunity employer, committed to fostering a diverse and inclusive workplace that attracts exceptional talent and supports employees to succeed at all levels.
Job Description
Technology & Innovation Organization Hardware Engineering Internship is a 12-week paid summer internship that lets you apply your classroom learnings to real-world challenges, with a thoughtful balance of networking, executive speakers, community involvement, and fun projects.
Requirements
- 3rd Year of University completed or 1st year of Masters completed
- Able to obtain work authorization in the United States in 2026, and not require sponsorship in the future
- Bachelor’s or Master's Degree with a focus on Hardware Engineering, Electrical Engineering, Mechanical Engineering, Industrial Design, or related technical field
Benefits
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- 4-12 weeks fully paid parental leave based on tenure
- 13 paid holidays
- 15 days paid time off
