Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering

Join an inclusive team passionate about innovation for customers and partners, with a focus on using expertise in relentless pursuit of innovation. Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all.

Requirements

• Process Development: Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
• Equipment and Materials: Evaluate and promote new equipment and materials to enhance process capabilities
• Quality Improvement: Ensure defense coverage through process, measurement, inspection, and testing
• Collaboration and Coordination: Work closely with internal and external partners to build and execute technology development strategies

Benefits

• Comprehensive health insurance
• Dental insurance
• Vision insurance
• 401(k) or retirement plan
• Paid time off
• Paid holidays
• Employee assistance program