Engineer, HIG HBM Package PE
Micron TechnologyTaichung, Taiwan
Posted August 5, 2025
Full Time
About the Company
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Description
We are seeking an Engineer to join our HIG HBM Package PE team. The successful candidate will lead a global team of professional product engineers to drive package PE activities within the HBM Systems and Product Engineering Team. The role requires strong leadership skills, technical skills, and experience in the semiconductor industry.
Requirements
- Bachelor's/Master's degree in Electrical Engineering
- 1+ years of experience in the semiconductor industry
- Strong leadership skills and technical skills
- Dedicated and highly motivated
- Proven track record of collaborative work within/across teams
- Strong sense of responsibility and accountability
Benefits
- Generous Paid Time Off
- 401k Matching
- Retirement Plan
- Visa Sponsorship
- Four Day Work Week
- Generous Parental Leave
- Tuition Reimbursement
- Relocation Assistance