Intern, Failure Analysis Engineering - Spring 2026

The Intern, Failure Analysis Engineering will work with pSemi FA engineers to learn and master the pSemi Failure Analysis flow. The learning will cover integrated circuit (IC) failure mode electrical bench verification, IC fault isolation techniques, physical analysis of isolated failure site, and FA report writing.

Requirements

• Perform preliminary failure analysis as needed, including: external visual examination, scanning acoustic microscopy, radiographic examination, and bench testing.
• Perform electrical bench testing and interpret ATE datalogs to aid in localizing electrical failures.
• Perform integrated circuit (IC) fault isolation to identify failure mechanism(s) utilizing schematics, layouts, IC design analysis, Focused Ion Beam (FIB) pad microprobing, device characterization, Photon Emission Microscopy (PEM), Externally Induced Voltage Alteration (XIVA) and IR Thermal Emission.
• Work with FA, product, design and technology engineers to isolate root cause of failures.
• Generate detailed failure analysis reports for both internal and external customers.
• Work toward becoming an expert at fault isolation techniques such as PEM, XIVA, and IR Thermal Emission.

Benefits

• Competitive hourly rate of $25.63 - $48.60
• Paid training and development opportunities