Senior Engineer(Wirebond Process Development)
NexperiaSeremban, Negeri Sembilan, Malaysia
Posted November 14, 2025
Full Time
About the Company
Nexperia is a semiconductor company that values diversity and is committed to being inclusive. We offer a safe work environment and reasonable adjustments where requested.
Job Description
The Senior Engineer (Wirebond Process Development) is responsible for designing, developing, optimising, and industrialising wire bonding processes for advanced semiconductor packaging. This role supports New Product Introductions (NPI), technology roadmap projects, and continuous process improvement in high-volume manufacturing (HVM).
Requirements
- Bachelor’s or Master’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
- Minimum 5 years in semiconductor wire bonding process development or engineering.
- Proven experience in Cu/Ag/Au wire bonding, fine-pitch or high-pin-count bonding, and new product qualifications.
- Strong understanding of bonding theory, metallurgy, and wire-material-substrate interactions.
- Skilled in equipment troubleshooting, bonding profile tuning, and defect analysis.
- Proficient in JMP, Minitab, or equivalent tools for DOE and statistical analysis.
- Excellent project management, communication, and cross-functional leadership skills.
- Familiar with automotive, JEDEC, and AEC-Q100 reliability standards for bonding.