Senior Packaging Engineer
Teledyne Technologies IncorporatedMilpitas, California, United States • Garland, Texas, United States
Posted December 22, 2025
113600 - 151400 USD year
Full Time
About the Company
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability.
Job Description
Senior Packaging Engineer role at Teledyne HiRel Electronics to lead packaging design initiatives and ensure products meet stringent reliability standards while driving innovation in integrated circuit packaging.
Requirements
- Strong knowledge of semiconductor electronics and IC packaging
- Master’s degree in engineering or equivalent experience (8+ years)
- Experience in aerospace and defense segment
- Familiarity with packaging materials and high-reliability applications
- MIL-STD 883 and 1835 experience
- Ability to work independently and on-site
- US citizenship and valid passport
- Ability to travel up to 10% domestically and internationally
Benefits
- Competitive compensation and benefits package