Package Design Engineer

Celestial AI is seeking an experienced Package Design Engineer to lead the design of Photonic Fabric package solutions. The ideal candidate will have a strong background in semiconductor packaging design and expertise in heterogeneous integration. The role requires cross-functional design collaboration with multiple engineering groups and external partners.

Requirements

• Package Design
• Heterogeneous integration
• Si/package/PCB/system co-design
• Pre/post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation
• Package layout based on I/O, SI-PI and form factor requirements
• 2.5D and 3D Package Design Planning and Execution
• Netlist management for heterogeneous chiplet assemblies
• Substrate Manufacturing and OSAT Assembly Engagement
• Qualification of package and board level assembly

Benefits

• Competitive base salary
• Bonus
• Generous grant of early-stage equity
• Health insurance
• Vision insurance
• Dental insurance
• Life insurance
• Collaborative and continuous learning work environment