Principal Silicon Photonics Packaging Engineer
Coherent Corp.Fremont, California, United States
Posted November 3, 2025
Full Time
About the Company
Coherent is a global leader in lasers, engineered materials and networking components, with a comprehensive career development platform and a competitive compensation program.
Job Description
Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production. Collaborate with cross-functional teams to develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan.
Requirements
- Bachelor's degree with 9 years of related experience in optical and IC packaging
- Or Master's degree with 7 years; or a PhD with 4 years experience
- Expertise in advanced IC packaging design, FOWLP, RDL, bumping, flip-chip
- Experience with high-speed differential and single ended impedance-controlled signal routing
- Experience with Silicon Photonics IC packaging
- Experience with organic substrate design and packaging
Benefits
- Competitive compensation program
- Comprehensive career development platform
- Stability, longevity and growth opportunities