Mechanical/Hardware Engineer III

Mechanical/Hardware Engineer III role at Hewlett Packard Enterprise in Chippewa Falls, Wisconsin. Designs, analyzes, develops, modifies and evaluates materials, mechanical systems, equipment and packaging. Conducts feasibility, design margin and validation analysis and empirical testing on new and modified designs.

Requirements

• Bachelor's or Master's degree in Mechanical Engineering
• 4-6 years experience
• Using ProEngineer or other 3D CAD software as a mechanical design tool
• Strong analytical and problem solving skills
• Strong understanding and experience in electronics packaging
• Designing sheet metal and plastic parts and associated production tooling and processes
• Using CFD and thermal mockups to validate thermal solution

Benefits

• Health & Wellbeing
• Personal & Professional Development
• Unconditional Inclusion