Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron TechnologySingapore, Singapore
Posted September 29, 2025
Full Time
About the Company
Micron is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.
Job Description
Join Micron's team as a Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering. Develop and enable deployment of assembly processes for advanced packaging technologies, and work with peers and partners to coordinate technology development and launch.
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
- Experience with Visual Basic for automation and tool integration
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
- Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
- Tenacity to work effectively under timelines and limited resources
- Consistent track record to solve problems and address root causes
Benefits
- Competitive salary
- Comprehensive benefits package
- Opportunities for career growth and development