Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Micron is seeking a Principal/Senior Engineer to develop and enable deployment of processes related to post-fab wafer finishing in semiconductor manufacturing. The successful candidate will work with peers and partners to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
• 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
• Experience with Visual Basic for automation and tool integration
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes

Benefits

• Competitive salary
• Benefits package
• Opportunities for career growth and development
• Collaborative and dynamic work environment