Principal Engineer, Hardware Development Engineering

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. We are a key partner to some of the largest and highest-growth organizations in the world, and we are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Requirements

• 1 to 4 years of experience with PVD thin film deposition and characterization.
• Hands on experience with magnetic thin film properties measurements, understanding of TMR head technology both at the full film and device level or strong statistical data analysis skills are preferred.
• MS or PhD Degree in Engineering, Physics, Materials Science or a related field.

Benefits

• Paid vacation time
• Paid sick leave
• Medical/dental/vision insurance
• Life, accident and disability insurance
• Tax-advantaged flexible spending and health savings accounts
• Employee assistance program
• Other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity
• Tuition reimbursement
• Transit
• Applause Program
• Employee stock purchase plan
• WD Savings 401(k) Plan