IC Packaging Engineer

This role involves evaluating and improving packaging technologies. The IC Packaging Engineer will work with suppliers on new packaging solutions, focusing on efficiency, cost, and footprint reduction. Responsibilities include process development, testing, and collaboration with cross-functional teams. Minimum 5-10% travel required.

Requirements

• M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 5 years of experience in IC packaging
• In-depth knowledge in chiplet integration, RDL fanout and CoW technologies
• Knowledge in silicon node BEOL and device physics or component/board level reliability testing are plus
• Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task.
• Good written and verbal communication skills
• Independent research and development work with minimal supervision