IC Packaging Simulation Engineer
AppleSanta Clara, California, United States
Posted October 20, 2025
147400 - 272100 USD year
Full Time
About the Company
Apple is an equal opportunity employer committed to inclusion and diversity.
Job Description
The IC Packaging Simulation Engineer will work on stress and deformation simulation of IC packages, providing a deep understanding of chip-package and package-board interactions to ensure good device yield and reliability. They will also be involved in scripting software and generating AI/ML models for automated model generation.
Requirements
- BS and 3+ years of relevant industry experience
- Bachelor’s degree in related field
- Proven capability in mechanics and mathematics
- Hands-on experience with major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.)
- Proficiency with numerical simulation software tools and expert in MATLAB and/or Scientific Python
- Deep understanding of packaging materials and reliability
- Excellent written and verbal communication skills
Benefits
- Comprehensive medical and dental coverage
- Retirement benefits
- Discounted products and free services
- Tuition reimbursement
- Discretionary bonuses or commission payments