IC Package Engineer
EtchedCupertino, California, United States
Posted February 19, 2025
Full Time
About the Company
Etched specializes in developing cutting-edge servers by integrating transformer architecture directly into their chips. This innovative approach results in unparalleled processing power for transformer-based inference tasks. The company's core value proposition lies in its ability to deliver superior performance and efficiency, making it a leader in the AI hardware sector.
Job Description
Etched is building AI chips for specific model architectures, focusing on high throughput and low latency. They are seeking an experienced IC Package Design Engineer to own the end-to-end package design process, from substrate layout to package design, leveraging advanced packaging technologies like CoWoS and large-scale BGA designs. This role ensures the mechanical and electrical integrity of packages critical for the next generation of AI hardware.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, or related discipline
- 5+ years of experience in advanced IC package design, including CoWoS or equivalent technologies
- Proven experience in substrate layout and BGA package design for large ball arrays ( >4000 balls)
- Strong understanding of stiffener design, open vs. closed package requirements, and package warpage/coplanarity
- Proficiency in package design tools such as Cadence APD/SIP, Mentor Xpedition, or similar
- Solid communication skills
- Experience with advanced packaging nodes (2.5D/3D stacking)
- Knowledge of thermal management techniques
- Previous experience working in AI, HPC, or semiconductor design companies
Benefits
- Full medical, dental, and vision packages
- Housing subsidy
- Daily lunch and dinner in the office
- Relocation support
